The adhesion of a thin film or a layer system on a substrate or the strength of a bond (solder joint, wirebond) play a significant role in their functionality. Therefore the examination of associated parameters is important. E.g. the shear strength of a bond is measured by pushing with a chisel against a bond until it raptures (shear bond strength tester). The characterisation of the site of fracture can be analysed using scanning electron microscopy.