Packaging technologies

Wafer-level technologies

  • Waferlevel Bonder EVG 510
  • Wafer dicer Accretech SS30
  • Vacuum solder oven VLO 850
  • Die bonder Tresky T-3000-FC3
  • Wire bonder Delvotec 5630
  • Dispenser EFD 1500
  • Vacuum solder oven VLO 850
  • Various high temperature ovens