Structuring infrastructure

Photolithography

  • Priming Hotplate Sawatec HP-200-HDMS
  • Spincoater Sawatec SM-180-BM
  • Spincoater Sawatec SM-200-BM
  • Spray-Coater Sawatec i-Spray-300
  • Hotplates Sawatec HP-150
  • Hotplate Sawatec HP-310/350
  • Circulating air ovens Haraeus UT6/UT6P
  • Maskaligner EVG 620
  • Maskaligner Süss MA/BA-8 inkl. NIL-Aufsatz SMILE
  • Spray-Developer Sawatec SMD-250-BM
  • Various bathes for immersion development (including circulation, heating and filtration)
  • Bathes for quick dump rinse, overflow rinse, N2-bubbling incl. conductance measurement
  • Coarse cleaning:
    • Ultrasonic bath, heated
    • Piranha cleaning
    • Bathes for quick dump rinse, overflow rinse, N2-bubbling incl. conductance measurement
  • Precision cleaning:
    • Various bathes for cleaning (including circulation, heating and filtration)
      • Piranha cleaning (H2SO4:H2O2)
      • SC-1 (NH4OH:H2O2)
      • SC-2 (HCl-H2O2)
      • HF
      • Bathes for quick dump rinse, overflow rinse, N2-bubbling incl. conductance measurement
  • Solvent cleaning:
    • Various bathes for solvent cleaning (including circulation, heating and filtration and ultrasonic agitation incl. frequency mixing)
      • Various bathes for aceton and IPA (incl. heating, US and goods movement)
      • Various bathes for resist stripping (incl. heating, US and goods movement)
      • Bathes for quick dump rinse, overflow rinse, N2-bubbling incl. conductance measurement
  • Glass, ceramic, oxide and nitride structuring:
    • Various baths for the etching of glass, oxide and nitride (incl. circulation, heating and filtration)
      • Glass etching bath (various HF etching solutions)
      • BHF  bath (buffered HF solution for SiO2 structuring)
      • SiN etching bath (H3PO4 etching solution)
      • Bathes for quick dump rinse, overflow rinse, N2-bubbling incl. conductance measurement
  • Silicon structuring:
    • Various etching bath for structuring crystalline or anisotropic silicon (incl. circulation, heating and filtration)
      • KOH etching bath (anisotropic etching of crystalline silicon)
      • TMAH etching bath (anisotropic etching of crystalline silicon, CMOS compatible)
      • Poly-etch (structuring of polysilicon or amorphous silicon)
  • Metal structuring:
    • Various bathes for metal thin-film etching (partially incl. circulation, heating and filtration)
  • Substrate rinsing and drying:
    • Centrifugal dryer Sawatec TSM-180-BM
    • Spin-Rinse-Dryer SRD PSC-102
    • Hot water washer/dryer
    • Circulation air ovens Haraeus UT6
  • Silicon etching tool DRIE STS Pegasus
  • Oxide etching tool STS AOE
  • Reactive ion etcher ECR Plasmatherm SRL-770
  • Plasma cleaner Barrel-Asher Branson/IPC Reactor Center PM-11030
  • PVA Tepla plasma system GIGABatch 380M
  • Plasma cleaner UCP

Further technologies for microstructure fabrication are available in cooperation with other groups and competence areas:

 

  • Selective laser etching (SLE)
  • Micro casting (PDMS)
  • Micro injectionmolding Babyplast

Senior Research Engineer - Leiter Reinraum

+41 58 257 34 57marco.cucinelli(at)ost.ch