Packaging technologies

Wafer-Level

Waferlevel Bonder EVG 510
Wafer dicer Accretech SS30
Vacuum solder oven VLO 850

Die-Level

Die bonder Tresky T-3000-FC3
Wire bonder Delvotec 5630
Dispenser EFD 1500
Vacuum solder oven VLO 850
Various high temperature ovens