Packaging technologies

Wafer-Level

  • Waferlevel Bonder EVG 510
  • Wafer dicer Accretech SS30
  • Vacuum solder oven VLO 850

Die-Level

  • Die bonder Tresky T-3000-FC3
  • Wire bonder Delvotec 5630
  • Dispenser EFD 1500
  • Vacuum solder oven VLO 850
  • Various high temperature ovens

Contact

Dietmar Bertsch, Dipl. Ing. HTLSenior Research Engineer Fachverantwortlicher Packaging

+41 58 257 34 71dietmar.bertsch(at)ost.ch