Mechanical Measurements

The adhesion of a thin film or a layer system on a substrate or the strength of a bond (solder joint, wirebond) play a significant role in their functionality. Therefore the examination of associated parameters is important. E.g. the shear strength of a bond is measured by pushing with a chisel against a bond until it raptures (shear bond strength tester). The characterisation of the site of fracture can be analysed using scanning electron microscopy.

IMP Institut für Mikrotechnik und PhotonikWissenschaftlicher Mitarbeiter, Experte für Röntgenanalytik

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