Layer thickness determination

Facilities for non-destructive and destructive coating thickness determinations are available:

Non-destructive layer thickness measurement

  • of Cu layers on printed circuit boards
  • of plastics and anodised layers on non-magnetic base material
  • of electroplated layers and lacquer layers on ferrous materials

Measurement methods

  • magnetic inductive (DIN EN ISO 2178)
  • magnetic (DIN EN ISO 2178) with eddy current (DIN EN ISO 2360)
  • electrical resistance (4 peaks)
  • X-ray fluorescence (in individual cases)

Destructive layer thickness measurement

After suitable preparation of the sample, it is viewed under the light or scanning electron microscope. In both cases, PC-supported image analysis is used for evaluation.

Dr.-Ing. Kerstin Kern

IMP Institut für Mikrotechnik und Photonik Projektleiterin und Fachverantwortliche Werkstoffprüfung

+41 58 257 34 08